Guide To Selecting The Thermally Conductive Heat Sink Tape, Pads, and Epoxy Adhesives Solution For Your Assembly 

3M thermal tape die cut

Designed to be the heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes), these materials are available with a variety of characteristics.

If you’re in prototyping phase of your project, reach out to our team. We can help determine the whole thermal management assembly solution – design collaboration, thermal material sourcing, and prototyping samples.



For Assembly of High Continuous Operating Temperature Components, Gleicher Customizes 3M™ Thermally Conductive (Heat Sink) Tape, Pads, and Epoxy Adhesives Solutions  

3M provides a full range of tape and adhesive solutions for attachment, bonding, joining, security, product identification and protection, to meet the requirements of the electronics industry. Thermal tapes, pads and epoxies provide high thermal conductivity by focusing on the 2 areas that matter most: bulk conductivity and interface conductivity.

There are three product formats to meet most LED lighting and electronics assembly challenges:

Thermal Tapes and Heat Shield Tapes:

This range of high adhesion thin thermal tapes offers bonding strength and efficient heat dissipation for applications such as heat sink mounting and LED lighting thermal management.  These thermal tapes provide excellent long term reliability, electrical insulation and flame retardant performance. 3M thermal transfer tapes are available in a variety of thicknesses to meet your most challenging thermal applications.  No mess, no clips, no long cure time!  Gleicher can expertly die or laser cut to your size or shape.

Thermal Tape Applications: Heat sink-Thermal Interface Attachment‎, Battery Thermal Management‎, LED Lighting Thermal Management‎, Heatsink-Thermal Interface-Non Bonding‎, Flex Bonding‎, Thermal Interface-Damping-Cushioning, Thin Bonding for Flex 3M Thermally Conductive TapeCircuit and Power Transformer Bonding to Heat Sinks, Heat Spreaders or other Cooling Devices

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Technical Data Link
Typical Application
8805, 8810,  8815, 8820,
  • Acrylic thermally conductive adhesive transfer tapes, currently in stock
  • High adhesive strength, improved surface wet-out and excellent shock performance
  • Several thicknesses
  • Can use with low surface energy substrates
  • Stocked
  • Acrylic thermally conductive double coated tape with thin PET carrier
  • Higher thermal conductivity 1.5 W/m-K
  • Reworkable
  • Several thicknesses
9882, 9885, 9890
  • Acrylic thermally conductive adhesive transfer tapes
  • Best results with high surface energy substrates

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Thermal Heat Sink Pads:

3M also offers a line of silicone based thermal pads ranging in thermal conductivity from 1.0 W/m-K to 4.9 W/m-K. For applications using a thermal pad, the 3M Acrylic Thermal pads are slightly tacky on one side for generally acceptable 3M Thermal Interface Pad 5590Hassembly adhesion in many applications. The tack adhesion strength of the 3M Thermal Pads is sufficient for holding the product in place for assembly and use, etc. in many applications.

Specifically for LED Lighting Thermal Management, the end use design of the LED Structure/Thermal Pad/Heat Sink does require an added mechanical means of assembly to ensure long term mechanical integrity and thermal performance.

Thermal Pad Applications: Battery Thermal Management‎, Thermal Gap Pad‎, Thermal Interface-Damping-Cushioning‎

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Technical         Data Link
5570N  1.3W/m-K 5589H Softer
5590H Higher
  • Acrylic thermally conductive interface pads
  • Gleicher can die cut or laser cut to size
  • 5590H currently stocked
5514, 55155516, 5516S, 5519, 5549S, 5583S, 5586, 5591, 55595, 5595S
  • Silicone thermally conductive interface pads
  • Gleicher can die cut or laser cut to size

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Thermally Conductive Epoxy Adhesives:

3M™ Thermally Conductive Epoxy Adhesives have minimal odor and superior structural strength. Dispensing is easy for high output, in-line automated manufacturing and manual applications. Adhesive flows and fills micro-spaces on surfaces. Ultra-thin bond lines help achieve low thermal impedance.

These epoxies and urethanes are ideal for applications requiring high adhesive strength and excellent surface wet-out. They can provide a thermal interface between IC packages or PCBs and heat sinks or other cooling devices as well be3M Thermally Conductive Epoxy Adhesive TC2810 used as thermally conductive potting compounds.

Thermally Conductive Epoxy Adhesive Applications: Thermal Material Potting‎, Heatsink-Thermal Interface Attachment‎, Battery Thermal Management, LED Lighting Thermal Management‎, Heatsink-Thermal Interface-Non Bonding‎

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Technical Data Link
Typical Application
TC-2707, TC-2810
  • Thin bond line
  • Higher thermal conductivity than tape
  • Higher shear, peel strength than tape


Thermal Management Material Combinations and Die or Laser Cutting:

We can also combine products, laminate solutions, cut to size, and deliver in multiple formats to match your manual or automated assembly processes. If you want your tape or pad die cut or laser cut into strips, shapes or with precise registrations, contact us at with dimensions and quantity for a free estimate!


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